1. product pro?le 1.1 general description pnp general-purpose transistor in a small sot23 (to-236ab) surface-mounted device (smd) plastic package. npn complement: 2pd601art. 1.2 features n general-purpose transistor n small smd plastic package 1.3 applications n general-purpose switching and ampli?cation 1.4 quick reference data 2. pinning information 2PB709ART 45 v, 100 ma pnp general-purpose transistor rev. 01 19 march 2007 product data sheet table 1. quick reference data symbol parameter conditions min typ max unit v ceo collector-emitter voltage open base - - - 45 v i c collector current - - - 100 ma h fe dc current gain v ce = - 10 v; i c = - 2ma 210 - 340 table 2. pinning pin description simpli?ed outline symbol 1 base 2 emitter 3 collector 12 3 sym013 3 2 1
2PB709ART_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 19 march 2007 2 of 10 nxp semiconductors 2PB709ART 45 v, 100 ma pnp general-purpose transistor 3. ordering information 4. marking [1] * = -: made in hong kong * = p: made in hong kong * = t: made in malaysia * = w: made in china 5. limiting values [1] device mounted on an fr4 printed-circuit board (pcb), single-sided copper, tin-plated and standard footprint. table 3. ordering information type number package name description version 2PB709ART - plastic surface-mounted package; 3 leads sot23 table 4. marking codes type number marking code [1] 2PB709ART c5* table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v cbo collector-base voltage open emitter - - 45 v v ceo collector-emitter voltage open base - - 45 v v ebo emitter-base voltage open collector - - 6v i c collector current - - 100 ma i cm peak collector current single pulse; t p 1ms - - 200 ma i bm peak base current single pulse; t p 1ms - - 100 ma p tot total power dissipation t amb 25 c [1] - 250 mw t j junction temperature - 150 c t amb ambient temperature - 65 +150 c t stg storage temperature - 65 +150 c
2PB709ART_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 19 march 2007 3 of 10 nxp semiconductors 2PB709ART 45 v, 100 ma pnp general-purpose transistor 6. thermal characteristics [1] device mounted on an fr4 pcb, single-sided copper, tin-plated and standard footprint. fr4 pcb, standard footprint fig 1. power derating curve t amb ( c) - 75 175 125 25 75 - 25 006aaa990 100 200 300 p tot (mw) 0 table 6. thermal characteristics symbol parameter conditions min typ max unit r th(j-a) thermal resistance from junction to ambient in free air [1] - - 500 k/w r th(j-sp) thermal resistance from junction to solder point - - 140 k/w
2PB709ART_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 19 march 2007 4 of 10 nxp semiconductors 2PB709ART 45 v, 100 ma pnp general-purpose transistor 7. characteristics [1] pulse test: t p 300 m s; d 0.02. fr4 pcb, standard footprint fig 2. transient thermal impedance from junction to ambient as a function of pulse duration for sot23 (to-236ab); typical values 006aaa991 10 - 5 10 10 - 2 10 - 4 10 2 10 - 1 t p (s) 10 - 3 10 3 1 10 2 10 10 3 z th(j-a) (k/w) 1 0.75 0.50 0.33 0.20 0.01 0.10 0.05 0.02 0 d = 1 table 7. characteristics t amb =25 c unless otherwise speci?ed. symbol parameter conditions min typ max unit i cbo collector-base cut-off current v cb = - 45 v; i e =0a - - - 10 na v cb = - 45 v; i e =0a; t j = 150 c -- - 5 m a i ebo emitter-base cut-off current v eb = - 5 v; i c =0a - - - 10 na h fe dc current gain v ce = - 10 v; i c = - 2ma 210 - 340 v cesat collector-emitter saturation voltage i c = - 100 ma; i b = - 10 ma [1] -- - 500 mv f t transition frequency v ce = - 10 v; i c = - 1 ma; f = 100 mhz 70 - - mhz c c collector capacitance v cb = - 10 v; i e =i e =0a; f=1mhz --5pf
2PB709ART_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 19 march 2007 5 of 10 nxp semiconductors 2PB709ART 45 v, 100 ma pnp general-purpose transistor v ce = - 10 v (1) t amb = 150 c (2) t amb =25 c (3) t amb = - 55 c t amb =25 c fig 3. dc current gain as a function of collector current; typical values fig 4. collector current as a function of collector-emitter voltage; typical values i c /i b =10 (1) t amb = - 55 c (2) t amb =25 c (3) t amb = 150 c i c /i b =10 (1) t amb = 150 c (2) t amb =25 c (3) t amb = - 55 c fig 5. base-emitter saturation voltage as a function of collector current; typical values fig 6. collector-emitter saturation voltage as a function of collector current; typical values i c (ma) - 10 - 1 - 10 2 - 10 - 1 006aab028 200 300 100 400 500 h fe 0 (1) (2) (3) v ce (v) 0 - 10 - 8 - 4 - 6 - 2 006aab029 - 0.04 - 0.06 - 0.02 - 0.08 - 0.1 i c (a) 0 i b (ma) = - 0.75 - 0.7 - 0.6 - 0.5 - 0.4 - 0.3 - 0.2 - 0.1 - 0.65 - 0.55 - 0.45 - 0.35 - 0.25 - 0.15 - 0.05 006aab030 - 0.5 - 0.9 - 1.3 v besat (v) - 0.1 i c (ma) - 10 - 1 - 10 2 - 10 - 1 (1) (2) (3) 006aab031 i c (ma) - 10 - 1 - 10 2 - 10 - 1 - 10 - 1 - 1 v cesat (v) - 10 - 2 (1) (2) (3)
2PB709ART_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 19 march 2007 6 of 10 nxp semiconductors 2PB709ART 45 v, 100 ma pnp general-purpose transistor 8. package outline 9. packing information [1] for further information and the availability of packing methods, see section 13 . fig 7. package outline sot23 (to-236ab) 04-11-04 dimensions in mm 0.45 0.15 1.9 1.1 0.9 3.0 2.8 2.5 2.1 1.4 1.2 0.48 0.38 0.15 0.09 12 3 table 8. packing methods the indicated -xxx are the last three digits of the 12nc ordering code. [1] type number package description packing quantity 3000 10000 2PB709ART sot23 4 mm pitch, 8 mm tape and reel -215 -235
2PB709ART_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 19 march 2007 7 of 10 nxp semiconductors 2PB709ART 45 v, 100 ma pnp general-purpose transistor 10. soldering fig 8. re?ow soldering footprint sot23 (to-236ab) fig 9. wave soldering footprint sot23 (to-236ab) solder resist occupied area solder lands solder paste dimensions in mm sot023 1.00 0.60 (3x) 1.30 1 2 3 2.50 3.00 0.85 2.70 2.90 0.50 (3x) 0.60 (3x) 3.30 0.85 sot023 4.00 4.60 2.80 4.50 1.20 3.40 3 21 1.20 (2x) preferred transport direction during soldering dimensions in mm solder resist occupied area solder lands
2PB709ART_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 19 march 2007 8 of 10 nxp semiconductors 2PB709ART 45 v, 100 ma pnp general-purpose transistor 11. revision history table 9. revision history document id release date data sheet status change notice supersedes 2PB709ART_1 20070319 product data sheet - -
2PB709ART_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 19 march 2007 9 of 10 nxp semiconductors 2PB709ART 45 v, 100 ma pnp general-purpose transistor 12. legal information 12.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 12.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 12.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 12.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 13. contact information for additional information, please visit: http://www .nxp.com for sales of?ce addresses, send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors 2PB709ART 45 v, 100 ma pnp general-purpose transistor ? nxp b.v. 2007. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 19 march 2007 document identifier: 2PB709ART_1 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 14. contents 1 product pro?le . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description. . . . . . . . . . . . . . . . . . . . . . 1 1.2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data. . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 thermal characteristics. . . . . . . . . . . . . . . . . . . 3 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 packing information. . . . . . . . . . . . . . . . . . . . . . 6 10 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 12 legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 12.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 12.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 contact information. . . . . . . . . . . . . . . . . . . . . . 9 14 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
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